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bga chip repair machine WDS 700 With HD Camera For iphone ic remove machine CPU EMMC U2 IC Chip Soldering

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Key attributes

Other attributes

Condition
New

Machine Type
bga repair machine

Applicable Industries
Retail

Showroom Location
None

Video outgoing-inspection
Provided

Machinery Test Report
Provided

Marketing Type
New Product 2020

Warranty of core components
1year

Core Components
PLC

Place of Origin
Guangdong, China

Warranty
1 Year

Key Selling Points
Easy to Operate

Weight (KG)
50KG

Brand Name
WDS pcb solder station

Voltage
110V/220V

Current
dependable

Rated Capacity
2500W

Rated Duty Cycle
100%

Dimensions
L450*W470*H670mm

Usage
bga repair machine

Total power
ic remove machine

Lower heating power
1200W

PCB size
140*160mm,Min 5*5mm

BGA chip size
80*80mm, Min 1*1mm

Locating Mode
V-shape card slot, PCB holder can be adjustable by X and Y axes

Color
White and blue

Electrical Material
High sensitive temperature control module, Touch Screen (Taiwan)

Warranty
1 year,lifetime maintainence

Training
Free training of the operation via webcam or in factory

Weight
45kg

After Warranty Service
Video technical support, Online support, Spare parts, Field maintenance and repair service

Local Service Location
None

After-sales Service Provided
Free spare parts, Field installation, commissioning and training, Field maintenance and repair service, Video technical support, Online support

Certification
CE ISO

Packaging and delivery

Packaging Details
bga chip repair machine WDS 700 With HD Camera For iphone ic remove machine CPU EMMC U2 IC Chip Soldering

Selling Units:
Single item

Single package size:
50X50X70 cm

Single gross weight:
60.000 kg

Lead time

Quantity (pieces)1 - 1 > 1
Lead time (days)3To be negotiated

Customization

Customized logo
Min. order: 10

Product descriptions from the supplier

Minimum order quantity: 1 piece
$3,200.00

Variations

Total options:

Shipping

Shipping solutions for the selected quantity are currently unavailable

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